Heat Sink with Metallization

Diamond copper-clad sheets combine the ultra-high thermal conductivity of diamond (600–800 W/m·K) with the excellent electrical conductivity of copper. With customizable sizes and layered thickness (diamond: 0.3–1.0 mm, copper: 0.1–0.5 mm), they are ideal for thermal management in high-power modules and microelectronic devices, ensuring efficient heat dissipation and stable device performance.

Categories: CVD Heat Sink Wafer, Heat Sink with Metallization

Description

Description: Diamond copper-clad sheet adopts a composite structure of diamond and copper, combining the high thermal conductivity of diamond and the excellent electrical conductivity of copper.

Specifications:

· Size: customized according to customer needs

· Thermal conductivity: 600-800 W/m·K

· Thickness: diamond layer 0.3-1.0 mm, copper layer 0.1-0.5 mm

· Application: heat dissipation of high-power electronic devices, power modules

Application cases:

· Power module: used for heat dissipation of high-power power modules, diamond copper-clad sheet can provide excellent thermal conductivity while maintaining good electrical conductivity to ensure stable operation of the module.

· Microelectronic devices: In microelectronic devices, diamond copper-clad sheet can effectively solve thermal management problems and prevent device performance degradation caused by heat accumulation.