Diamond heat sink

CVD diamond is a superior electrical insulator and high-performance heat sink material for high-power electronic and optoelectronic devices. With thermal conductivity up to 2000 W/m·K, low thermal expansion (~1.4×10⁻⁶ °C⁻¹), and high resistivity (>10⁶ Ω·cm), it ensures efficient heat dissipation. Available in 0.2–1.5 mm thickness with single or double-sided polishing, it is ideal for laser diodes, power microwave devices, and high-density IC packaging.

Categories: CVD Heat Sink Wafer, Diamond heat sink

Description

CVD diamond is an excellent insulation material, it is a ideal heat sink material in the high-power electronic and optoelectronic devices .

• Thermal conductivity 1200~ 2000W/m•K (@ 300K),
• Resistivity >106Ω•cm.
• Coefficient of thermal expansion ～1.4×10-6℃-1
• Single or double sided polishing available, Between 0.2 mm and 1.5 mm.
• Tolerance of Thickness: ±30um.
• Surface roughness: Ra 0.03μm.
• Flatness: <5um/cm.
• serve as heat sink in laser diodes , as packaging materials in high-density integrated circuits and power microwave devices.