Single crystal diamond stands at the pinnacle of thermal management materials, with thermal conductivity exceeding 2000 W/m·K—nearly five times that of copper and more than ten times that of aluminum nitride. It offers exceptional electrical insulation, low thermal expansion (~1×10⁻⁶ /K), and chemical stability, making it ideal for next-generation semiconductor packaging, especially GaN and SiC devices. Our CVD-grown single crystal diamond heat spreaders are available with diameters up to 3 inches, currently the largest in the commercial market. The flatness (<5 µm), parallelism, and surface finish (Ra < 5 nm) are tightly controlled, ensuring seamless integration into demanding high-frequency and high-power environments.