This MPCVD CVD diamond heat spreader is engineered for next-generation thermal management in high-power electronic and semiconductor applications. With a diameter of approximately 300 mm and a thickness of ~1.0 mm, it offers an exceptional thermal conductivity ≥1200 W/m·K, enabling rapid heat spreading and effective hotspot reduction.

Combining electrical insulation, high chemical stability, and excellent compatibility with metallization and advanced packaging, CVD diamond significantly outperforms conventional materials such as copper, AlN, and SiC. It is an ideal solution for power semiconductor modules, RF devices, laser systems, and advanced semiconductor packaging, where reliability and thermal efficiency are critical.